造孔剂含量对多孔SiC预制件孔隙率的影响及孔隙率测定方法探究.pdf

材料导报B:研究篇
2013年7月(下)第27卷第7期
造孔剂含量对多孔SiC预制件孔隙率的影响及孔隙率测定方法探究
刘玫潭2,蔡旭升2,何丽娇2,李国强,2
(1华南理工大学发光材料与器件国家重点实验室,广州510640;2华南理工大学材料科学与工程学院,广州510640)
摘要采用模压成型法制各了SiC预制件,分别采用阿基米德法、质量体积法和压汞仪法测试了其孔隙率,并
对浏试结果进行比較分析。结果表明,阿基米德法测试结果偏小,这是因为此方法测量的是孔径较大的气孔的显气
孔率;质量体积法与压汞仪法测试結果较为接近。比较AISC复合材料中Al合金体积分数和3种方法的测试结果
表明,质量体积法测试结果与Al合金体积分数最接近,是一种简单可靠的孔隙率测试方法。进一步探究了预制件孔
隙率与造孔剂舍量之间的关系。结果表明,当造孔含量较少时,孔隙率增加不明显,当造孔剂含量高于5%时,随
着造孔剂含量的增加,孔陬率大体上呈线性增加趋势。当造孔剂含登为14%时,孔隙率近40%,完全满足后续渗AI
需要。
关键词SC预制件孔隙率压汞仪法质量体积法阿基米德法造孔剂
中图分类号:TG146
文献标识码:A
Effect of Pore-forming Agents Content on Porosity and Experimental Study on
Porosity Measurement of Porous SIC Preform
LIU Meitan,2, CAI Xusheng 2, HE Lijiao,, LI Guoqiang
(1 State Key Laboratory of Luminescent Materials and Devices, South China University of Technology, Guangzhou 510640;
2 chool of Materials Science and Engineering, South China University of Technology, Guangzhou 510640)
Abstract The Sic preform was prepared by compression molding. The porosity of porous SIC preform was de
termined by Archimedes method, mass-volume method and mercury intrusion method, the measured results were com
pared. The results showed that the porosity measured by Archimedes method was small because the open porosity was
large, the test results of mass-volume method and mercury intrusion method were near, then Al alloy volu-me fraction
in Alsic composite and porosities measured by the above three methods were also compared. The
ts proved that
the porosity measured by mass-volume method has an excellent agreement with Al alloy volume fraction in Alsic com
posite. Therefore the mass volume method is a simple and practical method of porosity measuring. Then the effects of
the pore-forming agents content on the porosity of SIC porous preform were investigated. The results showed that th
porosity rose unobvously with the content of pore-forming agents when content of pore forming agents was less than
5%; and that the porosity rose linearly in general when content of pore-forming agents was more than 5%. And the
porosity tended to 40% when the pore-making agents content was 14%, which can fully meets subsequent Al infiltra
tion requirements.
Key words ic preform, porosity, mercury intrusion method, mass-volume method, Archimedes method,
pore-forming agents
0引言
外新研发的散热基板材料有金属芯印刷电路板( MCPCB)、
覆铜陶瓷板2(DBC)和金属基低温烧结陶瓷基板(LTCC
随着微电子器件向高性能、轻量化和小型化方向发展,M)。其中,金属芯印刷电路板热导率受到绝缘层的限制,热
微电子对封装材料提出越来越苛刻的要求。传统的封装材导率低,且不能实现板上封装;覆铜陶瓷板采用直接键合方
料包括硅基板、金属基板和陶瓷基板等。硅基板和陶瓷基板式将陶瓷和金属键合在一起,提高了热导率,同时使得热膨
的加工困难,成本高,热导率低;金属材料的热膨胀系数与微胀系数控制在一个合适的范围,但金属和陶瓷的反应能力
电子芯片不匹配,使用过程中将产生热应力而翘曲。因此,低,润湿性不好,使得键合难度高,界面结合强度低,易脱落:
这些传统的封装材料很难满足封装基板的苛刻需求。国内金属基低温烧结陶瓷基板对成型尺寸精度要求高,工艺复
因家安全重大基础研究(国防973);国家自然科学基金(51002052);广东省战略新兴产业专项资金(2011A081301010)
刘攻潭:女,1989年生,硕士,研究方向为金属基复合材料E-mail:lwt3274192@163.com李国强:通讯作者,男,1979年生,博
士,教授,博导,研究方向为金属基复合材料、光电化合物半导体材料与器件Tel:020-87112957E- mail: msglic@scut.edu,cr