含羧基硅氧烷的制备及其固化动力学研究.pdf
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- 关 键 词:
- 羧基 硅氧烷 制备 及其 固化 动力学 研究
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第29卷第4期
无机化学学报
Vol29 No 4
2013年4月
CHINESE JOURNAL OF INORGANIC CHEMISTRY
810-816
含羧基硅氧烷的制备及其固化动力学研究
王政周刚甘芸张敷明*
(南京大学化学化工学院,南京210093)
摘要;通过氯丙基甲基硅氧烷与过量的对苯二甲酸的缩合反应制备了一种新型的含羧基硅氧烷(CCS),CCS可以同双酚A型环
氧树脂固化,根据 Kissinger和 Crane方程,用差热分析(DSC)对CS和环氧树脂组合物的固化性能进行了分析。分析结果表明
组合物固化反应的表观活化能为71.41kJ·mol,反应级数为0.911;还给出了加热速度为10℃·min1时的固化反应方程。
关键词:硅氧烷;组合物;交联;差热分析(DSC);活化能
中图分类号:0627.41
文献标识码
文章编号:1001-4861(2013)040810-07
DOI:10.3969/fisn.1001-4861.2013.00.129
Synthesis of a Carboxyl-containing Silicone and Its Curing Kinetics
WANG Zheng ZHOU Gang GAN Yun ZHANG Dun-ming
(School of Chemistry and Chemical Engineering Nanjing University, anjing 210093, China
Abstract: A new carboxyl-containing silicone (CS)was synthesized by condensation reaction of
chloropropylmethylsiloxane and excess amount of terephthalic acid. The CCS cured with a bisphenol A type epoxy
resin, and the kinetics of curing reaction of the CCS/epoxy resin composites was investigated by employing
differential scanning calorimetry (DSC)basing on the Kissingers and Cranes approaches. As a result, the apparent
activation energy and reaction order of the curing reaction are 71. 41 KJmol and 0.911, respectively. The curing
kinetic equation at a heating rate of 10 Cmin was given
Key words: silicones; composites crosslinking; differential scanning calorimetry(DSC); activation energy
0 ntroduction
crosslinking agents as well as adding additives or
third components are effective ways to improve the
is an important material for flexibility and toughness of cured epoxy resin i6.
adhesive, encapsulation, molding
ng Among them, functional polysiloxanes or silicones is
elin
crosslinkable with curing agents such as polyamine or the most attractive one due to the elastic structure and
aromatic acid anhydride. The crosslinked epoxy resin heat resistance of the silicones, and most of the
is well known as its good adhesive performance, high polysiloxanes or silicones contained epoxy group or
mechanical strength, excellent electrical properties amino group
and high thermal resistance 1-. However, for the
In this study, a novel carboxyl-containing silicone
common epoxy resin,
rigid and fragile, thus (CCS)was designed. As shown in Scheme 1, the
hardly applicable in the fields where more flexibility reaction
3-chiorop
Dimethylsiloxane and
is needed*5. It has been reported that selecting proper terephthalic acid was employed. Therefore, there are
收稿日期:2012-10-15。收修改稿日期:2012-12-14
“通讯联系人。E-mil: dmzhang@nju.edu,cn,Tel:18905168586
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