水平机械研磨酸性镀铜工艺研究.pdf

第23卷第6期
材料科学与工艺
Vol 23 No 6
2015年12月
MATERIALS SCIENCE &TECHNOLOGY
Dec.2015
doi:10.11951/j.i.1005-0209.20150608
水平机裓硏磨酸性镀铜工艺研究
吴娜梅,冯长杰,胡水莲,袁烁
(南昌航空大学材料科学与工程学院,南昌330063
摘要:为研究不同研磨珠直径对镀层细化及性能的影响,在寃酸盐性镀铜溶液肀添加玻璃殊,玻璃的运动对A3
钢表面产生机械研磨作用(MA),并采用扫描电镜、显微硬度測试仪、电化学工作站等方法对其进行观察和分析.结果表
明:与传统硫酸酸性镀铜层相比,机械研镀匋层的膜厚和孔隙率降低,硬度、耐歛性、防渗碳性能提高;机梽硏镀
层的晶粒尺寸大小随着研磨直径的增大先減小后增大;当研磨珠直径为8mm时,镬层的晶粒尺寸小于2um,硬度达到
168.3HV,孔豫率为0.6个/cm2,渗碳层的厚度为40pm
关键词:镀;机械研磨;酸性镀;耐蚀性;防渗磯性
中图分类号:TG174.441
文献标志码:A文章编号:1005-0299(2015)06-0040-06
Process and properties of horizontal mechanical attrition copper
electroplating in acid solution
WU Namei, FENG Changjie, HU Shuilian, YUAN Shuo
School of Materials Science and Engineering, Nanchang Hangkong University, Nanchang 330063, China
Abstract: To investigate the influence of different diameters of glass balls on the microstructure and properties
of mechanical attrition electroplating, the movement of glass balls has mechanical attrition(MA)action effect
on A3 steel in a traditional acidic copper plating with sulfate by adding glass balls. Scanning electron
microscopic characterization(SEM), micro-hardness test and electrochemical experiments were performed in
this research. The results showed that, compared to the traditional electroplated copper plating, the thickness
and porosity of copper plating with MA were reduced, the hardness, corrosion resistant and the property of
anti-carburizing of the copper plating were increased. With increase in the diameters of the glass balls, the
grain size of copper plating with MA was first reduced and then increased. When the diameter of glass balls was
8 mm, the grain size of the copper plating was< 2 wm, the hardness was 168.3 HV, the porosity was
0.6/cm and the thickness of carburized layer was 40 um
Keywords electroplating; mechanical attrition acid copper plating; corrosion resistant; anti-carburizingr
表面机械研磨处理(SMAT)是近来一种基于机械研磨处理与电沉积技术相结合的新型电沉积
传统塑性变形机制(SPD)而发展的技术川,也是方法.该方法是指在电沉积槽液中添加研暦介质
一和能在许多材料表面纳米化的技术2?.研究表在电积过程中利用振滂器使研磨介质在阴极表
明“9,SMAT技术能够在大部分金属材料“0-1月』面以一定的速度运动,当研磨介质与阴极表面相
表面合成晶粒度细小、无污染或无孔的表面镀层.接触时,在阴极表面产生塑性变形,从而使镀层表
而在此文中的机械研磨电镀(MAFE)则是将表面面性能提高
酸性电镀铜具有成分简单、镀液稳定、电流效
收稿日期:2015-03-27.
率高、价格便宜等优点5,应用于工业生产已有
基金项目:江西省教育部资助项口(DB201301052)
作者简介:吴娜梅(1990-),女,硕十研究生
百多年的历史;并且铜层具有高触点,铜原子不
冯长杰(1977ー),男,教授,硕十生导师
能充分浴解于γ-Fe且碳不与铜形成固溶体或者
通信作者:冯长杰,F.-mail:chjfengniat(@126.com
化合物的特性,故铜层可以用作防渗镀层?.由