多孔金刚石坯体熔渗铜工艺.pdf

第18卷第2期
粉末治金材料科学与工程
2013年4月
Vol18 No.2
Materials Science and Engineering of Powder Metall
Apr 2013
多孔金刚石坯体熔渗铜工艺
任淑彬,郭彩玉1,李改,何新波,曲选辉,陈志宝2
(1.北京科技大学新材料技术研究院,北京100083
2.江西省科学院应用物理研究所,南昌330029
摘要:金刚石/Cu具有优异的热物理性能,采用熔渗法可以实现金刚石Cu的近净成形,本文对多孔金刚石坯
体熔滲铜的相关工艺及影响因素进行了较深入的研究。研究结果表明,在多孔坯体上下方都放置铜块时对熔渗过
稞比较有利;熔渗温度达到1200℃、压力为20MPa、保温30min时复合材料致密度达到99.8%,接近全致密,
热导率可以达到587W(mK),进一步提高熔滲温度和延长保温时间时,该复合材料的致密度没有显著变化,热
导率下降,这主要与界面结构变化引起的界面热阻变化有关。熔渗过程存在孕育期,熔渗温度低于1200℃或压
力低于20MPa时,复合材料的致密度较低,甚至不能完成熔渗。
关键词:铜基复合材料;多孔金刚石坏体;熔滲;热导率
中图分类号:TB333文献标识码:A
文章编号:1673-0224(2013)2-205-6
Copper infiltration process of porous diamond preforms
REN Shu-bin, GUO Cai-yu', LI Gai, HE Xin-bo, QU Xuan-hui, CHEN Zhi-bao
(1. Institute of Advanced Materials and Technology,
University of Science and Technology Beijing, Beijing 100083, China
2. Institute of Applied Physics, Jiangxi Academy of Science, Nanchang 330029, China
Abstract: Diamond/copper composites have good thermal-physical properties and could be net-shape formed by
infiltration. In the present paper, relevant process and influencing factors of porous diamond preforms infiltrated by
copper were studied. The results show that it is helpful to infiltration of copper into diamond preforms when the copper
are placed on both the top and the bottom of the preform. The density of the composites can reach 99.8% which is near
full density, and the thermal conductivity can reach 587 W/m K, when the infiltration is carried out at 1 200 with 20
Mpa and hold for 30 min, however there is no obvious change for the density by further incerasing the infiltration
temperature and holding time, and the thermal conductivity may decrease. This is associated with the increase of
interfacial thermal resistance due to the change of interface structure. There is an incubation period during the pressure
infiltration process, that is the density may decrease and the infiltration even can not be completed when infiltration
temperature is below 1 200 C or pressure is less than 20 Mpa
Key words: Cu matrix composites; porous diamond preforms; infiltration; thermal conductivity
金刚石增强铜基复合材料综令了金刚石的高热?积分数较高,通常超过55%,因此导致该材料很难进
率、低膨胀系数以及铜的高热导率等优异性能,具有行后期的机械加工,大大限制了该种材料在实际工程
较高的热导率和可调的热膨胀系数,是目前大功率微中的广泛应用,因此开发该种材料的近净成形工艺已
波器件芯片封装材料研究开发的热点到。金刚石颗粒成为当务之急?
増强铜基复合材料用作电子散热材料时,金刚石的体
本文提出采用粉末注射成形工艺制备金刚石预制
基金项目:国家自然科学基金资助项日(51004010);贛鄱英才55工程资助项日
收稿日期:2012-05-04;修订日期:2012-05-28
通讯作者:任淑彬,副研究员,博士。电话:010-8237286:E-mail:brent@Sohu.com