低松比片状银粉及其银浆的微观分析.pdf

2014年12月
云南治金
Dec,2014
第43卷第6期(总第249期
YUNNAN METALLURGY
Vol 43. No 6(Sum249)
低松比片状银粉及其银浆的微观分析
杨桂生2,陈步明2,胡新,郭忠诚
(1.昆明冶金高等专科学校冶金材料学院,云南昆明650033;
2.昆明理工大学冶金与能源工程学院,云南昆明650093)
摘要:采用电化学和高能球臍法制备了低松比片状银粉,硏究不同松比的银粉对粒径分布和比表面积的对
应关系,并通过SEM和EDS进行表征,结果发现:片状银粉的松比比球状银粉的小,最小松比可以达到0.4012
片状银粉的松比跟它的比表面积有关,松比越大,比表面积越大,而与片状银粉的粒径形状关系不大
随着片状银粉松比的减小,制得浆料的微观组织变得更致密,黑色孔洞会更少,浆料表面的致密性越好。
关键词:低松比;片状银粉;电子浆料;微观分析
中图分类号:TF1221.5文献标识码:A文章编号:1006-0308(2014)06-0043-07
The Micro-analysis of Flake Silver Powders with
Llow Loose Specific Weight and Its Silver Paste
YANG Gu-sheng", CHEN Bu-ming",HU Xin, GUO Zhong-cheng
1. Material Science, Kunming Metallurgy College, Kunming, Yunnan 650033, China
2. Metallurgy and energy engineering college, Kunming University of Science and
Technology, Kunming, Yunnan, 650093, China)
ABSTRACT: he preparation of flake silver powder with low loose specific weight by electro chemistry and high energy ball-mining
method, we researched the corresponding relation for rain size isr ution and specific su ace area of the silver powder with the dif erent
loose specific we ht, and it was characte zd y EM an ED e resul how: the loose specific weight of lake silver powder is smaller
than spherical silver power, the smallest loose specif wei a each to. 401 m the loose specific weit is related to its specific
surface area, the bigger the loose specific weight, the bigger the specific surface area, but it has little relationship with grain size shape of
flake silver powder; the microscopie structure of paste shall be more compacted along with the decreasing of the loose specific weight of flake
silver powder, and the black hole shall be more less, and the compactness of paste surface
KEY WORDS low loose specific weight; electronic paste; Micro-analysis
叠、接触,对比球状银粉的点接触相,片状银粉之
间的接触面积会更大,所得到的导电网络电阻会相
目前低温浆料用银粉的形态大致存在五种类对较低,导电性能会更好。片状银粉有相对较大的
型,即微晶(粒径一般在1um以下)、球状、枝比表面积,较低的比表面能,较低的氧化度和氧化
叶状、磷片状、杆状,其中枝叶状和磷片状通常被趋势,因具有较宽的挠度范围和抗折裂伸张特性,
统称为片状,片状银粉的厚度一般在100nm以下。生产的电子元器件可靠性能高叫。用相同质量百
片状银粉与有机载体混合时,银片随载体漂泊、重分比的片状银粉和其他形状的银粉涂覆,片状银粉
*收稿日期:2011-08-01修改日期:2014-10-13
作者简介;杨桂生(1972-),男,云南曲靖人,副教授,研究方向;表面工程。