J-STD-003线路板可焊性测试.pdf
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- STD 003 线路板 可焊性 测试
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AMERICAN NATIONA
STANDARD
ANS/J-STD-003
APRIL 1992
JOINT
INDUSTRY
STANDARD
Solderability Tests
for
Printed Boards
IPC
Notice
EIA and TPC Standards and Publications are designed to serve the public interest
tine th
chaser in selecting and obtaining with minimum delay the proper product for his
ed. Existence of such Standards and Publications shall
respect preclude any member or nonmember of ELA or IPC from manulacturing or
selling products not conforming to such Standards and Publications, nor shall the
existence of such Standards and Publications preclude their voluntary use by those
other than ELA or IPC members, whether te standard is to be used either domest
cally or internationall
Recommended Standards and Publications are adopted by ELA and IPC without
regard to whether their adoption may involve patents on articles, materials, or pr
cesses. By such action, ELA and IPC do not assume any liability to any patent
owner, nor do they assume any obligation whatever to parties adopting the Recom-
mended Standard or Publication. Users are also wholly responsible for protecting
themselves against all claims of liabilities for patent infringement
The material in this joint standard was developed by the EIA Soldering Technology
Committee (STC)and the IPC Soldering/Solderability Specifications Task Group
(5-23
APPROVED JUNE 2. 1992 ASAN
AMERICAN NATIONA
STANDARD
AMERICAN NATIONAL STANDARDS NSTITUTE
For Technical informnation Contact
Electronic Industries Association The Institute for Interconnecting
Engineering Department
and Packaging Electronic Circuits
2500 Wilson Boulevard
2215 Sanders Road
Ig ton, VA 22201
Phone(703)907-7500
Phone(847)509-9700
Fax(703)907-7501
Fax(847)509-9798
Please use the Standard Improvement Form shown at the end of this
document
Copyright 1996 by the Electronics dusties Association and the Insti ute for Interconnecting and Packaging Electronic Circuits. All rights
reserved. Published 1996. Printed in the United States of America
No part of this publication may be reproduced in any form, in an electronic retrieval system or otherwise, without the prior written permission
of the publisher.
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