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类型J-STD-003线路板可焊性测试.pdf

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    关 键  词:
    STD 003 线路板 可焊性 测试
    资源描述:
    AMERICAN NATIONA
    STANDARD
    ANS/J-STD-003
    APRIL 1992
    JOINT
    INDUSTRY
    STANDARD
    Solderability Tests
    for
    Printed Boards
    IPC
    Notice
    EIA and TPC Standards and Publications are designed to serve the public interest
    tine th
    chaser in selecting and obtaining with minimum delay the proper product for his
    ed. Existence of such Standards and Publications shall
    respect preclude any member or nonmember of ELA or IPC from manulacturing or
    selling products not conforming to such Standards and Publications, nor shall the
    existence of such Standards and Publications preclude their voluntary use by those
    other than ELA or IPC members, whether te standard is to be used either domest
    cally or internationall
    Recommended Standards and Publications are adopted by ELA and IPC without
    regard to whether their adoption may involve patents on articles, materials, or pr
    cesses. By such action, ELA and IPC do not assume any liability to any patent
    owner, nor do they assume any obligation whatever to parties adopting the Recom-
    mended Standard or Publication. Users are also wholly responsible for protecting
    themselves against all claims of liabilities for patent infringement
    The material in this joint standard was developed by the EIA Soldering Technology
    Committee (STC)and the IPC Soldering/Solderability Specifications Task Group
    (5-23
    APPROVED JUNE 2. 1992 ASAN
    AMERICAN NATIONA
    STANDARD
    AMERICAN NATIONAL STANDARDS NSTITUTE
    For Technical informnation Contact
    Electronic Industries Association The Institute for Interconnecting
    Engineering Department
    and Packaging Electronic Circuits
    2500 Wilson Boulevard
    2215 Sanders Road
    Ig ton, VA 22201
    Phone(703)907-7500
    Phone(847)509-9700
    Fax(703)907-7501
    Fax(847)509-9798
    Please use the Standard Improvement Form shown at the end of this
    document
    Copyright 1996 by the Electronics dusties Association and the Insti ute for Interconnecting and Packaging Electronic Circuits. All rights
    reserved. Published 1996. Printed in the United States of America
    No part of this publication may be reproduced in any form, in an electronic retrieval system or otherwise, without the prior written permission
    of the publisher.
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