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类型SEMI G42-0996 SPECIFICATION FOR THERMAL TEST BOARD STANDARDIZATION.pdf

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    SEMI G42-0996 SPECIFICATION FOR THERMAL TEST BOARD STANDARDIZATION G42 0996
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    SEMI G42-0996
    SPECIFICATION FOR THERMAL TEST BOARD STANDARDIZATION
    FOR MEASURING JUNCTION-TO-AMBIENT THERMAL RESSTANCE
    OF SEMICONDUCTOR PACKAGES
    NOTE This entire document was revised in 1996
    1 Purpose
    M/1-st1-883c-method 1012.1 Thermal Charac
    This document provides the requirements for a stan
    teristics
    dard thermal resistance test board to be used in iunc
    tion-to-ambient thermal resistance measurement of a
    4 Terminology
    semiconductor package under still-and forced-air con
    tion temperature, Ty -In degrees Celsius is
    dition as a referee method
    used to denote the temperature of the semiconductor
    junction in the microcircuit in which the major part of
    2 Scope
    the heat is generated. Usually the measured junction
    2. I This document describes the thermal resistance
    temperature is only indicative of the temperature in the
    immediate vicinity of the element used to sense the
    test board for measurement of the following packages
    temperature
    Dual-in-line Packages (DIP
    bient th
    Plastic Chip Carrier Package ( PCC
    degrees Celsius/watt is the temperature difference
    Quad Flat Package(QFP)
    between the junction and the ambient, divided by the
    power dissipation PUI
    Pin Grid Array Package(PGA)
    is the heating
    Ball Grid Array Package (BGA)
    power applied to the device causing a junction-to-ref-
    2.2 This document uses SI units
    erence point temperature difference
    4.4 temperature sensitive parameter, 1SP Is the
    3 Referenced Documents
    temperature dependent electrical characteristic of the
    Information regarding the methods for measuring junc-junction under test which can be calibrated with
    tion-to-ambient thermal resistance, the proper design respect to temperature and subsequently used to detect
    and use of thermal test chips, and material specifica-the Junction temperature of interest
    tions for printed circuit boards, can be found in the
    applicable documents listed below
    5 Ordering Information
    3.1 SHMI Specifie
    Ing
    board can be ordered through any electronic supply
    Unencapsulate
    store
    Test Chi
    SEMI G38 Test Method for Still- and Forced-air 6 Requirements
    Junction-to-ambient Thermal Resistance Measure
    General requirements regarding the materials used for
    ments of Integrated Circuit Pack ages
    test board, the specified physical dimensions of the test
    3. 2 Military Specifications
    board and other necessary conditions are described in
    the following paragraphs
    M/1-P-13949 Material Specification for NEMA
    Grade G-10 Printed Circuit Board Material
    6.1 Material Requirements
    6. 1. 1 The test board material should be NEMA Grade
    G-10 or equivalent
    I Military Standards, Naval Publications and Iorm Center; 5801
    Tabor Avenue, Philadelphia, P1 19120
    SEMIG42-0996のSEMI1986.1996
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