SEMI G42-0996 SPECIFICATION FOR THERMAL TEST BOARD STANDARDIZATION.pdf
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SEMI G42-0996
SPECIFICATION FOR THERMAL TEST BOARD STANDARDIZATION
FOR MEASURING JUNCTION-TO-AMBIENT THERMAL RESSTANCE
OF SEMICONDUCTOR PACKAGES
NOTE This entire document was revised in 1996
1 Purpose
M/1-st1-883c-method 1012.1 Thermal Charac
This document provides the requirements for a stan
teristics
dard thermal resistance test board to be used in iunc
tion-to-ambient thermal resistance measurement of a
4 Terminology
semiconductor package under still-and forced-air con
tion temperature, Ty -In degrees Celsius is
dition as a referee method
used to denote the temperature of the semiconductor
junction in the microcircuit in which the major part of
2 Scope
the heat is generated. Usually the measured junction
2. I This document describes the thermal resistance
temperature is only indicative of the temperature in the
immediate vicinity of the element used to sense the
test board for measurement of the following packages
temperature
Dual-in-line Packages (DIP
bient th
Plastic Chip Carrier Package ( PCC
degrees Celsius/watt is the temperature difference
Quad Flat Package(QFP)
between the junction and the ambient, divided by the
power dissipation PUI
Pin Grid Array Package(PGA)
is the heating
Ball Grid Array Package (BGA)
power applied to the device causing a junction-to-ref-
2.2 This document uses SI units
erence point temperature difference
4.4 temperature sensitive parameter, 1SP Is the
3 Referenced Documents
temperature dependent electrical characteristic of the
Information regarding the methods for measuring junc-junction under test which can be calibrated with
tion-to-ambient thermal resistance, the proper design respect to temperature and subsequently used to detect
and use of thermal test chips, and material specifica-the Junction temperature of interest
tions for printed circuit boards, can be found in the
applicable documents listed below
5 Ordering Information
3.1 SHMI Specifie
Ing
board can be ordered through any electronic supply
Unencapsulate
store
Test Chi
SEMI G38 Test Method for Still- and Forced-air 6 Requirements
Junction-to-ambient Thermal Resistance Measure
General requirements regarding the materials used for
ments of Integrated Circuit Pack ages
test board, the specified physical dimensions of the test
3. 2 Military Specifications
board and other necessary conditions are described in
the following paragraphs
M/1-P-13949 Material Specification for NEMA
Grade G-10 Printed Circuit Board Material
6.1 Material Requirements
6. 1. 1 The test board material should be NEMA Grade
G-10 or equivalent
I Military Standards, Naval Publications and Iorm Center; 5801
Tabor Avenue, Philadelphia, P1 19120
SEMIG42-0996のSEMI1986.1996
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