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类型SEMI M9.6-95 STANDARD FOR ROUND 125 mm DIAMETER POLISHED.pdf

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    SEMI M9.6-95 STANDARD FOR ROUND 125 mm DIAMETER POLISHED M9 95
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    SEM M9.6-95
    STANDARD FOR ROUND 125 mm DIAMETER POLISHED
    MONOCRYSTALLINE GALLIUM ARSENIDE WAFERS
    The complete specification for this product includes all general requirements of SEMI M9
    Table 1 Dimension and Tolerance Requirements
    Property
    Dimension
    olerance
    Units
    DIAMIETER
    125.0
    土0.3
    THICKNESS CENTER POINT
    PRIMARY ORIENTATION FLAT
    121.0
    土0.3
    mm
    DIAMETERA
    SECONDARY FLAT DIAMETERB
    123.5
    土0.3
    mm
    A Actual Primary Oricntation Flat Lcngth depends on allowcd variation in thc wafer diamter and thc oricntation flat diamctcr
    Variation in Primary Oricntation Flat Lcngth is calculatcd assuming that thc cnd points of Primary Oricntation Flat will havc cur-
    vature of a circle of radius R=( or R=3 mm this circle wil be tangent to the orientation flat and also tangent to the wafer cir
    cumfercncc. Calculated nominal lincar Icngth of Primary Oricnlalion Flat(thc straight part of the lal)arc 4400mm in a casc of
    R=0 mm and 42.90 respectively on a case of R=3 mm
    B Actual Secondary Flat Length also depends on allowed variation in the wafer diameter and the Secondary Flat Diameter. Varia
    tion in Sccondary Flat Lcngth is calculatcd Calculatcd nominal lincar Icngths of th Sccondary Flat(the straight part or the nat
    are 27.22 mm in the case of R=0 mm, and 26.25 Im, respectively, in the case of R=3 mm
    Table 2. Orientation and Flat-location Requirements
    P
    ropert
    Reguirement
    PRIMARY FLAT ORIENTATION
    (011)+ 1.0, under an Arscnic facct. The primary flat shall bc
    dicular to thc Vetch fi
    SECONDARY FLAT ORIENTATION
    90°±5° counterclockwise from the primary flat.
    SURFACE ORIENTATION
    (100)士0.5°( scc Fimurc1inM9)
    100)off 2+0.5 towards the(10 )plane which is between the
    primary and sccondary flats(scc Figure 3 in M%)
    ORTHOGONAL MISORIENTATION
    ±5°( see Figure5inM9)
    A The frame of reference is the(100)plane of the crystal. It is the wacr normal that is tilted towards the(110)planc of the crystal
    cc Tablc I
    Using A-B, bromine-methanol, ammonium hydroxide: hydrogen peroxide etch. See Figures I through 4 Figure I also show
    the orientation of the V-groove figure relative to the KOH etch pits
    NOTICE: These standards do not purport to address safety issues, if any, associated with their use. It is the
    responsibility of the user of these standards to establish appropriate safety and health practices and determine the
    applicability of regulatory limitations prior to use. SEMI makes no warranties or representations as to the suitabil-
    ity of the standards set forth herein for any particular application. The determination of the suitability of the stan
    dard is solely the responsibility of the user. Users are cautioned to refer to manufacturers instructions, product
    labels, product data sheets, and other relevant literature respecting any materials mentioned herein. These stan
    dards are subject to change without notice
    SEMI N9.6-95 O SEMI1995,1996
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