SEMI M31-0999 PROVISIONAL MECHANICAL SPECIFICATION FOR FRONT.pdf

S E M
SEM M31-0999
PROVSIONAL MECHANICAL SPECIFICATON FOR FRONT-OPENING
SHIPPING BOX USED TO TRANSPORT AND SHIP 300 mm WAFERS
This provisional specification was technically approved by the Global Physical Interfaces Carriers
Committee and is the direct responsibility of the North American Physical Interfaces Carriers Committee
Currcnt edition approvcd by thc North Amcrican Rcgional Standards Commillcc on July 15, 1999. Initially
available on SEMT Onlinc August 1999 to bc published Scplcmbcr 1999 Originally published in 1998
previously published June 1999
1 Purpose
3 Referenced Standards
1.1 This standard parti
p
ly specifies the front
3. 1 SEMI Standards
shipping box FOSB)used to ship 300 mm wafers from SEMT E1 -Provisional Mechanical Specification for
wafer suppliers to their customers (typically IC Cassettes Used to Transport and Store 300 mm Wafers
manufacturers
SEM E15-specification for Tool Load Port
2 Scope
SEMI E15.1 -Provisional Specification for 300 mm
2.1 This standard is intended to set an appropriate Tool Load Port
level of specification that places minimal limits on SEMI E44 Guide for Procurement and Accep ance
innovation while ensuring modularity and inter
of Minienvironments
changeability at all mechanical interfaces. Only the
/sical interfaces for FOSB are specified; no materials SEMI E47.1 -Provisional Mechanical Specification
quirements or micro-contamination limits are given. for Boxes and Pods Used to Transport and Store 300
However. this standard has been written so that both
mm Wafers
metal, and inection- molded plastic FOS Bs can be SEMT E57 -Provisional Mechanical Specification for
manufactured in conformance with it
Kinematic Couplings Used to Align and Support 300
2.2 This standard assumes that the FOSB is used in the m Wafer Carriers
last process in wafer manufacturing, in acceptance and
SEMI E62-provisional Specification for 300 mm
inspection, and in transferring the wafers trom the
FOSB to a FOUP or open cassette inside an IC
Front-opening Interface Mechanical Standard (FIMS)
manufacturing facility. The FOSB is not intended to be SEMI S8-safety Guidelines for Ergonomics/Human
used in IC manufacturing processes. It is recommended Factors Engineering of Semiconductor Manufacturing
that wafers be transferred from the FOSB to a FOUP or Equipment
open cassette using automated methods. As described In NOTE 1: As listed or revised, all documents cited shall be the
ection 5.3, the purchaser needs to specify which type latest publications of adopted standards
of shipper door is required
1)Manual door as described in Section 5.3.1, or
4 Terminology
2 )Automated door as described in Section 5.3.2
bilaleral datum plane-a vertical plane that bisects
wafers and that is perpendicular to both the horizontal
2.3 This standard(as well as other 300 mm standards)and facial datum planes(as defined in SEMT ES7)
is provisional. Once FOSB testing and initial volume
production is done(or any change related to the FOSB box a protective portable container for a carrier
is made to a document listed in Section 3 below), this and/or substrate(s)(as defined in SEMI E44
standard should be modified and upgraded from
carrier
an open structure that holds one or more<