SEMI E14-93 MEASUREMENT OF PARTICLE CONTAMINATION CONTRIBUTED.pdf
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SEM E14-93
MEASUREMENT OF PARTICLE CONTAMINATION CONTRIBUTEDTO
THE PRODUCT FROMTHE PROCESS OR SUPPORT TOOL
CONTENTS
I introductio
1.1 Purpose
1. 2 Scope and Application
3 Protocols
1 4 Impact
1.5 Limitations
2 Referenced Documents
erminolog\
4 Measurement nstrument Eyaluation
4. 1 Methodology for Instrument Acceptance
4.2 Procedure for Instrument Calibration Acceptance
5 Measurement Instrument Monitoring
5. 1 Methodology for Instruments Monitoring
5.2 Procedure for Instrument Monit
5.3 Out-of-control Acti
6 Measuring PWP for Process Tool Acceptance
gy
for Process Tool Ac
for P
Tool Acceptance
7.1 SPC
Suggested Procedure for Process Tool Particle
ng
8 Additional R
mn Preparing PSL Calibration Wafe
A 2 Notes on Measurement Instrument Calibration
A3 Notes on Measurement Instrument Monitoring
A4 Notes on Process Tool Monito
SEME14-93SEMI1990.1996
NOTES
This page intentionally left blank
SEM F14-93
MEASUREMENT OF PARTICLE CONTAMINATION CONTRIBUTEDTO
THE PRODUCT FROMTHE PROCESS OR SUPPORT TOOL
Introduction
and out of an ellipsometer to the full simulation of a
This document describes the methods, procedures, and
CVD process including transport of a wafer into
application of a technique for determining the average
quartzware, pushing quartzware into a reactor chamber,
number of particles added to a wafer as a result of the
multiple purge/vent cycles, process simulation with
wafer being passed through a semiconductor process
inert gas flow including establishment of process pres
tool
sure, temperature ramping and soak, venting, cooldown
and transport back to the cassette. Although this proce-
1. 1 Pumpose-the purpose of this document is to pro-dure may be extended to actual fabrication processes, it
vide a standardized methodology and detailed procedure is primarily intended to be used to quantify contamina
for measuring the contamination performance of a par- tion added by a process tool and not by the actual pro
ticular process or tool in terms of the number and size cess
distribution of particles added to a silicon wafer as a
result of having been passed through that process tool. The measurement of PWP performance is in terms of
This standardized procedure is primarily intended to be
particles located on the front surface of the wafer; it
used for the qualification of new or repaired processing
does not apply to particles on the back surface of the
equipment, but may be extended to new processes or
rafer. It is important that both the customer and supplier
methods, continuous process or tool monitoring, and
follow the same test method. This will help to ensure
qualification of new materials. As a result, this docu
Ice on the same level and
ment contains supporting information; however, one
that actual performance of the equipment is discussed
may not need to read all of the information to determine 1.3 Protocols-figurel shows the sections included
the particles per wafer pass(PWP)of the process tool
in the applications portion of this document. The section
The measurement of surface particulate contamination
of most importance is Section 6. This section details
on a wafer as i展开阅读全文

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