SEMI G70-0996 STANDARD FOR EQUIPMENT AND LEADFRAME.pdf

SEMI G70-0996
STANDARD FOR EQUIPMENT AND LEADFRAME FXTURES FOR
MEASUREMENT OF PLASTIC PACKAGE LEADFRAMES
1 Purpose
Pub. No. 95 Registered and standard Outlines for
1.1 This standard describes the equipment and lead
Semiconductor Devices
frame fixtures used for measurement of Z axis dimen
4 Terminology
sions of plastic package leadframes
NOTE 2 See SEMI G57 for leadframe features termi
2 Scope
nolog
2.1 This standard mainly describes the equipment and 4.1 burr height-maximum height of burr above the
leadframe fixture for measurement of leadframes
plane which it protrudes.(See Figure 1.)
are <0. 15 mm in thickness as used fortsop and
TQFP packages listed in group I in Table I
2.3 This standard also may be applied for leadframe
of conventional packages which are 2 0.2 mm in thick
nes
Table 1. Package Classification
Group I
Group II
SSOP
DIP
TSOP
ZIP
TSSOP
SOJ
QFP
Burr Height
SOP
TQFP
QF J C PLCC)
LQFP
ongitudinal bowing of the leadframe
strip length.(See Figure 2.
SVP
NOTE 1: Packages should be classified by EIAJ and
Forward
JEDEC specifications
3 Referenced Documents
3 1 SEEMI Standard
SEMI G57 Guideline for Standardization of Lead
i-1 Coil Set
Trame l erminology
3.2 EIAJ Standard
E1-741 1 General Rules for the Preparation of Out
F
ure
2
line Drawings of Integrated Circuits, Packages Name
and Code
Coill Set
3.3 JEDEC Specifications
1 Standards of Electronic Industries Association of Japan, osho Bldg
51 3-2-2 Marunouchi, Chiyoda-ku, lokyo, Japan 100
2 JEDEC Standard, 2001 Eve Street, N H, Washington DC, 20006
SEM G70-0996 G SEM 1996
4.3 coined deplh -The difference in height between 4.6 die pad dimple deplh-the maximum depth of
the top surface of the coined area of an inner lead and the dimple. (See Figure 5.)
the t
ed area at the tip of the
Inner lead coining produces a flattened section of the
lead that is suitable for wire bonding. (See Figure 3.)
??
??
Dimple
Dimple
Coined Deptl
Figure 5
Die Pad Dimple Depth
f the cente
Figure 3
die pad surface from a plane established by the four cor
oined Depth
ner points of die pad. (See Figure 6.
4.4 crossbow- Transverse bowing of the leadframe
See Figure 4.)
St
HA E B
Y axis
X axis
Figure 4
Crossbow
4.5 die pad dimple-a hollow formed in a die pad
lfigure 6
using a half-etching technique or stamping to improve
IDIE Pad Flatness
the adhesive strength with the die or molding com-
pound and to reduce the stress between the die pad and
the die
SEMG70-09960 1996