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SEMI G77-0699 SPECIFICATION FOR FRAME CASSETTE FOR 300 MM.pdf

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    SEMI G77-0699 SPECIFICATION FOR FRAME CASSETTE 300 MM G77 0699
    资源描述:
    SEM G77-0699
    SPECIF CATON FOR FRAME CASSETTE FOR 300 MM WAFERS
    This tcst mcthod was technically approved by thc Global Asscmbly &Packaging Committce and is the dircct
    responsibility of the Japancsc Packaging Committce. Currcnt edition
    ed by thc Japancsc Rcgional
    Standards Committee on March 17, 1999. Initially available on SEMI Online May 1999; to be published
    Junc 1999
    1 Purpose
    3 Referenced Documents
    II The purpose of this document is to specify the 3.1 SHM/ Standard
    mechanical features for a 300 mm wafer frame cassette
    SEMI El.9-provisional Mechanical Specification for
    used between the wafer mounting process and the die
    Cassettes Used to Transport and Store 300 mm Wafers
    bonding process
    SEMI E15-specification for Tool Load Port
    2 Scope
    SEMI B47
    Provisional Mechanical Specification
    2. 1 This standard is intended to set an appropriate for Boxes and Pods Used to Transport and Store 300
    evel of specification that places minimal limits on mm Wafers
    while
    g
    d
    interchangeability at all mechanical interfaces
    SEMI E57-provisional Mechanical Specification for
    Kinematic Couplings Used to Align and Support 300
    2.2 Only the physical interfaces for the frame cassette mm Wafer Carriers
    are specified, no materials requirements or micr
    contamination limits are given. However, this
    SEMI G74- Specification for Tape Frame for 300
    specification was written to allow for both metal an
    mm Wafe
    plastic frame cassette designs
    SEMI S8- Safety Guidelines for Ergonomics/Human
    2. 3 This specification defines a 300 mm wafer frame
    Factors Engineering of Semiconductor Manufacturing
    cassette that is intended for both manual and automated Equipment
    transport. The frame cassette has the following
    components and sub-components ("indicates an
    4 Terminology
    optional component)
    4. 1 bilateria datum plane -a vertical plane that
    2.3.1Top
    bisects the tape frames and that is perpendicular to both
    robotic handling flange ( optional)
    the horizontal and facial datum planes (as defined in
    SEMI E57)
    top cover
    4.2 conveyor rails
    arallel surfaces on the botton
    2.3.2 nterior
    of the cassette for supporting the cassette on roller
    frame supports for 13 or 25 tape frames
    conveyors
    frame restraint
    3 facial datum plane-a vertical plane that bise
    the tape frames and that is parallel to the front side of
    23.3 Sides
    the frame cassette (where tape frames are removed or
    6 human handles(optional
    inserted ) On tool load ports, it is also parallel to the
    load face plane specified in SEMI E15 on the side of
    2.3.4 Rear
    the tool where the frame cassette is loaded and
    unloaded (as defined in SEMI E57)
    rear cover
    2.3.5 Bottom
    4.4 fiamme cassette-an open structure that holds one
    or more tape frames
    2 bottom conveyor rails running along the
    sides of the frame cassette
    4.5 horizontal datum plane-a horizontal plane from
    which projects the kinematic coupling pins on which
    0 3 features that mate with kinematic coupling
    the frame cassette sits. On tool load ports, it is at the
    pins and provide a 10 mm lead-in(optional
    load height specified in SEMI E15 and might not be
    0 4 frame cassette sending pads(optional)
    physically r
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