SEMI G77-0699 SPECIFICATION FOR FRAME CASSETTE FOR 300 MM.pdf

SEM G77-0699
SPECIF CATON FOR FRAME CASSETTE FOR 300 MM WAFERS
This tcst mcthod was technically approved by thc Global Asscmbly &Packaging Committce and is the dircct
responsibility of the Japancsc Packaging Committce. Currcnt edition
ed by thc Japancsc Rcgional
Standards Committee on March 17, 1999. Initially available on SEMI Online May 1999; to be published
Junc 1999
1 Purpose
3 Referenced Documents
II The purpose of this document is to specify the 3.1 SHM/ Standard
mechanical features for a 300 mm wafer frame cassette
SEMI El.9-provisional Mechanical Specification for
used between the wafer mounting process and the die
Cassettes Used to Transport and Store 300 mm Wafers
bonding process
SEMI E15-specification for Tool Load Port
2 Scope
SEMI B47
Provisional Mechanical Specification
2. 1 This standard is intended to set an appropriate for Boxes and Pods Used to Transport and Store 300
evel of specification that places minimal limits on mm Wafers
while
g
d
interchangeability at all mechanical interfaces
SEMI E57-provisional Mechanical Specification for
Kinematic Couplings Used to Align and Support 300
2.2 Only the physical interfaces for the frame cassette mm Wafer Carriers
are specified, no materials requirements or micr
contamination limits are given. However, this
SEMI G74- Specification for Tape Frame for 300
specification was written to allow for both metal an
mm Wafe
plastic frame cassette designs
SEMI S8- Safety Guidelines for Ergonomics/Human
2. 3 This specification defines a 300 mm wafer frame
Factors Engineering of Semiconductor Manufacturing
cassette that is intended for both manual and automated Equipment
transport. The frame cassette has the following
components and sub-components ("indicates an
4 Terminology
optional component)
4. 1 bilateria datum plane -a vertical plane that
2.3.1Top
bisects the tape frames and that is perpendicular to both
robotic handling flange ( optional)
the horizontal and facial datum planes (as defined in
SEMI E57)
top cover
4.2 conveyor rails
arallel surfaces on the botton
2.3.2 nterior
of the cassette for supporting the cassette on roller
frame supports for 13 or 25 tape frames
conveyors
frame restraint
3 facial datum plane-a vertical plane that bise
the tape frames and that is parallel to the front side of
23.3 Sides
the frame cassette (where tape frames are removed or
6 human handles(optional
inserted ) On tool load ports, it is also parallel to the
load face plane specified in SEMI E15 on the side of
2.3.4 Rear
the tool where the frame cassette is loaded and
unloaded (as defined in SEMI E57)
rear cover
2.3.5 Bottom
4.4 fiamme cassette-an open structure that holds one
or more tape frames
2 bottom conveyor rails running along the
sides of the frame cassette
4.5 horizontal datum plane-a horizontal plane from
which projects the kinematic coupling pins on which
0 3 features that mate with kinematic coupling
the frame cassette sits. On tool load ports, it is at the
pins and provide a 10 mm lead-in(optional
load height specified in SEMI E15 and might not be
0 4 frame cassette sending pads(optional)
physically r