SEMI E33-94 SPECIFICATION FOR SEMICONDUCTOR MANUFACTURING.pdf

SEMI E33-94
SPECIFCATION FOR SEMICONDUCTOR MANUFACTURING FACILTY
ELECTROMAGNETIC COMPATIBILTY
NOTICE: This standard does not purport to address 2.3 EMELEC, EN 55 022, 1987--modifications to
safety problems associated with its use. It is the CISPR 22
responsibility of the user of this standard to establish
2. 4 Draf British Standard 1 N 50 082-2-electro
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to the
magnetic Compatibility-generic Immunity Standard
Industrial( CL C/TC 1 10(Sec)44
use
25 Emerald Bookl_IEEE Recommended Practice
1 ntroduction
for Powering and Grounding Sensitive Electronic
Purpose
thi
quipment, IEEE, 1992
assure that semiconductor manufacturing facilities and 2.6 OS/S/)Association Advisory for electrostatic
the equipment used for manufacturing semiconductor Discharge Terminology -Glossary, 1992
devices will operate together reliably without failures
caused by electromagnetic interference or electrostatic
2.7 FIPS(Federal Information Processing Standards
discharge. This goal is generally known as"electromag
Publication 94, 21 September 1983 -Guideline on
netic compatibility or EMC
Electrical Power for ADP Installations
1. 2 Scope-this specification applies to facilities and
2.8 IEC801-2 Second Edition /991-04--electro
equipment constructed for the purpose of manufacturing
static Discharge Requirements
semiconductor devices including all facilities alarm. 29 /EC807-3 rst dition 19842-radiated Elec
safety, communications and control systems, processing tromagnetic Field Requirements
equipment, metrology equipment, automation equip
2 10 IEC. First Edition. 19882-electrical Fast
ment, and Information technology equipment
Transient/Burst Requirements
1.3 Limitations- This specification does not apply to
d for the assembly and 2.11 /1( C 65(Sec:137(807-3committee I)ra
functional testing of integrated circuits. This specifica-
huly 1992--surge Immunity Requirements
tion does not apply to process-specific charging that 2. 12 IC TC 65(Sec.1 44(801-6)Committee Draft,
may occur to semiconductors under manufacture
February 1992--immunity to Conducted Distur-
bances Induced by Radio Frequency Fields above 9
2 Referenced Documents
KHZ
2I ANS C63.4-1991 -American National Standard
for Methods of Measurement of Radio-noise Emissions
3 Terminology
from Low-voltage Electrical and Electronic Equipment 3. I earth port- European term for an equipment
in the Range of 9 KHZ to 40 GHZ
ground. This term is used extensively in the basic star
dards
2.2 ISPR. Publication 22 /9852-limits and
Methods of Measurement of Radio Interference Charac- 3.2 electromagnetic compatibility(EM) -The abil-
teristics of Information Technology Equipment
ity of electronic equipment to function properly with
respect to environmental EMI and ESD
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M/8855.
Sales /dministration(Draft.S ) BSL, Linford Hood, Mili
2 Sales Departmen of the Central O//ice af the LEC, P.O. Box 131
MK 14 61.E, linited Kingdom
Rue de Farembe, 1121 Geneva 20, Switzerland. Some of the IEC
4 EOSESD Association Inc. 200 Libera Pluza. Rome, NY 13440
publicatio