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类型SEMI P33-0998 PROVISIONAL SPECIFICATION FOR DEVELOPMENTAL.pdf

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    SEMI P33-0998 PROVISIONAL SPECIFICATION FOR DEVELOPMENTAL P33 0998
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    SEMI P33-0998
    PROVSIONAL SPECIFCATION FOR DEVELOPMENTAL 230 mm
    SQUARE HARD SURFACE PHOTOMASK SUBSTRATES
    1 Purpose
    tended for
    1. I To define the dimensional requirements for nomi
    patterning. Any and all chamfered corners are on the
    nally square hard surface photomask substrates of 230
    non-critical side (see Section 9.2, Figures 5 and 6)
    mm nominal edge length, for research on and develop-note: Selected terms relating to photomasking are
    ment of process and manufacturing equipment, pelli-given for information only in Appendix 2, Related
    cles, carriers, other accessory materials, and any Information
    related mask designs
    5 Ordering Information
    2 Scope
    hard surface ph
    2.I This specification covers information pertaining to strates furnished to this specification shall include the
    glass substrates for 230 mm square hard surface photo
    following
    masks. This information includes but is not limited to
    physical dimensions, testing criteria, and measurement
    ominal edge length. nominal thickness dimen-
    sion, edge criteria, and parallelism of major sides( see
    criteria
    lection 6)
    3 Referenced Documents
    5.1.2 Material(see Section 7)
    3.1 ANST/ ASC③ C Standard
    5.1.3 Flatness quality area and flatness Total Indicated
    Z1.4- Sampling Procedures and Tables for Inspec
    Reading(T I.R., see Section 8)
    tion by Attributes
    5.1.4 Visual quality area(see Section 9); and
    3.2 ASTM Standard-
    5.1.5 Lot acceptance criteria(see Section 10
    E 228-test for Linear Thermal Expansion of Rigid
    Solids with a Vitreous Silical Dilatometer
    6 Dimensions and Permissible Variations
    3.3 Federal Standards
    6. 1 The substrates shall conform to the dimensional
    tolerances appropriate to the nominal edge length and
    209E -Clean Room and Work Station Requirements, thickness as listed in Table 1. Dimensions are illus
    Controlled Environments
    trated in Figure I and a fixture for measuring the
    squareness dimensions is shown in Figure 2
    4 Terminology
    6.2 Substrates shall have beveled edges. The edges
    4. 1 230 mm - The nominal edge length for the reticle shall conform to the dimensional tolerances appropri
    generation defined in this specification. Also referred ate to the nominal thickness listed in Table 2 Dimen-
    to as 9 inch size
    sions are illustrated in Figure 3
    4.2 critical side- Major side intended for patterning. 6.3 The major sides of square substrates shall be par-
    The critical side has no chamfered corner(s)(see Sec- allel within 5.0 um along both major axes. Meaure
    tion 9. 2), and has flatness equal or better than the non- ments are taken within the quality flatness area, along
    critical side(see Section 8.1)
    both major axes. Calculation of parallelism is illus
    trated in Figure 7
    I american Society for Ouality Control, 61l East Wisconsin Avenue,
    milwaukee. FJ53202
    7 Material Specifications
    2 merican Society for festing Materials, 100 Barr labor Driv
    7.1 Substrate materials shall be specified ultra low
    West Conshohoken P4 79428-2959
    thermal expansion(ULTE).An example of ULTE
    3 General Devices ddminislrafor. #th and D Streets, 5. Room 005% material is fused silica( quartz)
    Washington D.C. 20407
    SEMI P33-0998 C SEMI 1998
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