SEMI G6-89 TEST METHOD FOR SEAL RING FLATNESS.SEMI G8-94 TEST.pdf
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SEM G8-94
TEST METHOD FOR GOLD PLATING
Preface
22 Related omen/
1. 1 Purpose- This test method describes procedures 2. 2. 1 Military and Federal Specifications
to determine gold plating quality
Mil-s/D-105-sampling Procedures and Tables for
2 Scope -These methods apply to gold plating on Inspection by Attributes
cofired ceramic or metal packages. The grade, hard
ness, and thickness of the gold plating shall be speci
M/1-s71-202-test Methods for Electronic and
fied per MIL-G-45204 unless otherwise agreed Electrical Componenet Parts
between vendor and customer
MI1 -/9500 General Specification for Semi
Note I The gold plate may be over refractory metal on
conductor Devices
cofired ceramic packages or over an underplate on MIL-M-38510 General Specification for Microcir
metal packages
cults
2 Applicable Documents
3 Summary of Method
2.1 Referenced Documents
Various test methods are described or referenced to
2. 1. 1 SEMI Specifications -All SEMI package spec
determine gold plating quality for the following items
ifications
Visual Appearance
2. 1. 2 ASTM Sp
becifcallo/s
Plating Thickness
Plating Adhesion
B 384 Standard Test Method for Microhardness of
Materials
Functional tests
B 487 Test Method for Measurement of Metal and
Salt Atmosphere
Oxide Coating Thicknesses by Microscopic Examina-
Hardness
tion of a Cross-section
4 Significance and Use
B 567- Method for Measurement of Coating Thick
ness by the Beta Backscatter Method
4. 1 Significance-poorly plated components result
Iring p
B 568 Method for Measuring Coating Thickness by or to reliability problems
X-RAY Spectrometry
4.2 Use- The methods described in this document
F 1269 Test Methods for Destructive hear Testing may be used by vendors to test gold plated components
of Ball Bonds
as part of their process control program, or by custom
2. 1.2 Military and edera/pecification
ers at Incoming Inspections
MIL-STD-750- Test Methods for Semiconductor The methods are to used in conjunction with individual
Devices
component speclhcations
Ml1-s71)-883-test Methods and Procedures for 5 Terminology
Microelectronics
5.1 blister(metal)-an enclosed, localized separa-
Mil-g-45204-gold Plating, Electrodeposited
tion of a metallization layer from its base material
(such as ceramic or another metal layer )that does not
I American, Societ for Testing and Materials, 100 Barr 1larbor Drive
West Conshohoken P4 19428-2959
expose the underlying layer
2 Mililar Standards Nava/ Publications and 4om Center. 5801
The change in color of any
1abor Avene, Philadephia, P/ 19120
plated metallization, gold, silver, aluminum, etc, as
SEM O SEM1983 1996
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