SEMI M1.15-1000 STANDARD FOR 300 mm POLISHED MONOCRYSTALLINE.pdf

Se∩
SEMI M1.15-1000
STANDARD FOR 300 mm POLISHED MONOCRYSTALLINE SILICON
WAFERS(NOTCHED
This standard was technically approved by the Global Silicon Wafer Committee and is the direct
responsibility of the North American Silicon Wafer Committee. Current edition approved by the European
RcgionalStandardsCommillcconjuly28,2000.Initiallyavailablcalwww.scmiorgScptcmbcr2000;tobe
published October 2000. Originally published 1997, prcviously published Junc 2000
1 Referenced Standard
identification of these wafers and traceability of each
wafer back to the ingot from which it was cut. The back
1.1 SEM Standard
urface is identified as the wafer surface with the two
SEMI MI2 - Specification for Alphanumeric Marking dimensional matrix code symbol
of the Front Surface of Silicon Wafers
2.1.4 Optionally, the user may specify that no mark be
SEMI T7-specification for Back Surface Marking of placed on the wafer
Double-side Polished Wafers with a Two-dimensional NOTE 2: It is cxpcctcd that thc option ofno mark will
Matrix Code Symbol
eventually bccomc obsolete aftcr or if cxpcricncc with
SEMI T7 mark dcmonstralcs success
1.2 ASTM Standards
D 523- Test Method for Specular Gloss
back-surface mark (Note 3) that contains alphanumeric
F1530
Test Method for Measuring Flatness. characters with
Thickness, and Thickness Variation on Silicon Wafers 2.1.5.1 The same message characters as the SEMI T7
by Automated Noncontact Scanning
mark and appropriate checksum characters as defined
1 3 S Standard
by SEMI M12, and
Z 8741 -Method of Measurement for Specular 2. 1.5.2 Character string as specified in SEMT MI2
Glossiness
2.1.5.3 Single density dot matrix, 5 dots horizontal and
NOTE I: As lislcd or rcyiscd. all do
citcd shall be the 9 dots
i shall be used
latest publications of adoptcd standards
2. 1.5.4 Dot diameter shall be 100=+ 10 um (Note 4)
2 Requirements
2. 1.55 Character dimensions shall be as defined in
SEMI M12, Table 1 (nominal spacing= 1.42
III
2. 1 The complete specification for this product
includes all general requirements of SEMI MI except
nominal width=0.812 mm, nominal height=1.624
mm
for the following
2.1.1 The exclusion of wafers polished on both sides
2. 1.5.6 Mark location (center of botto mmost dot
in Section 13 of SEMI MI is deleted
relative to the reference point of the SEM T7 mark
shall be 1. 40+0.05 mm toward the wafer center. as
2.1.2 Particulate contamination (oc alized light shown in Figure 1
scatterer )requirements listed in Table 1 of SEMI M
(Polished Wafer Defect Limits)do not apply to thes
2.1.5.7 Mark field height, as defined by the distance
afer. Specification criteria and test methods for
between the centers of the topmost and bottommost dot
automated surface inspection of large wafers are under rows of the A/N characters, shall be 1.62 +0.03 mm
development
(Note
2.1.3 Wafers shall be marked with a two-dimensional 2. 1.5.8 Mark field enoh, as defined by the distance
matrix code symbol on the back surface outside the between the centers of the leftmost and rightmost dot
fixed quality area as soon after slicing a pactical in the columns of the A/N Cy eers, shall be 16.43 +0.07
manner specified in SEM T7 in order to