MIL-PRF-19500.461F-2008.pdf

MIL-PRF-19500/461F 30 May 2008 SUPERSEDING MIL-PRF-19500/461E 18 April 2003 * PERFORMANCE SPECIFICATION SHEET SEMICONDUCTOR DEVICE, TRANSISTOR, PNP, SILICON, HIGH-POWER, TYPE 2N6211, 2N6212, 2N6213, 2N6213A, JAN, JANTX, JANTXV, JANS, JANHC, AND JANKC This specification is approved for use by all Departments and Agencies of the Department of Defense. * The requirements for acquiring the product described herein shall consist of this specification sheet and MIL-PRF-19500. 1. SCOPE 1.1 Scope. This specification covers the performance requirements for PNP silicon, high-voltage. Four levels of product assurance are provided for each device type as specified in MIL-PRF-19500. Two levels of product assurance are provided for each unencapsulated device type. 1.2 Physical dimensions. See figure 1 (TO-66), and figure 2, JANHC and JANKC (die) dimensions. 1.3 Maximum ratings. Unless otherwise specified, TC = +25C. Type PT (1) TA = +25C PT (2) TC = +25C VCBO VCEO VEBO IB IC TJ and TSTG RJC (max) ZJX W W V dc V dc V dc A dc A dc C C/W C/W 2N6211 3.0 35 275 225 6.0 1.0 2.0 -65 to +200 5.0 1.75 2N6212 3.0 35 350 300 6.0 1.0 2.0 -65 to +200 5.0 1.75 2N6213 3.0 35 400 350 6.0 1.0 2.0 -65 to +200 5.0 1.75 2N6213A 3.0 35 500 450 6.0 1.0 2.0 -65 to +200 5.0 1.75 (1) Derate linearly at 17.1 mW/C for TA +25C. (2) Derate linearly at 200 mW/C for TC +25C. 1.4 Primary electrical characteristics. Unless otherwise specified, TC = +25C. hFE1 (1) VCE(SAT) (1) Cobo |hfe| Pulse response Limit VCE = 5 V dc IC = 1.0 A dc IB = -0.125 A dc 100 kHz f 1 MHz VCB = 10 V dc f = 5 MHz IC = 0.2 A dc VCE = 10 V dc ton toff IC = 1 A dc 2N6211 2N6212 2N6213 2N6213A IE = 0 2N6211 2N6212 2N6213 2N6213A Minimum 30 V dc V dc V dc pF 4 1.5 s s Maximum 175 1.4 1.6 2.0 220 20 10 0.6 3.1 (1) Pulsed (see 4.5.1). AMSC N/A FSC 5961 INCH-POUND * Comments, suggestions, or questions on this document should be addressed to Defense Supply Center, Columbus, ATTN: DSCC-VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to Semiconductordscc.dla.mil. Since contact information can change, you may want to verify the currency of this address information using the ASSIST Online database at http:/assist.daps.dla.mil/. The documentation and process conversion measures necessary to comply with this revision shall be completed by 30 August 2008 MIL-PRF-19500/461F 2 2. APPLICABLE DOCUMENTS * 2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this specification, whether or not they are listed. 2.2 Government documents. * 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. * DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-19500 - Semiconductor Devices, General Specification for. * DEPARTMENT OF DEFENSE STANDARDS MIL-STD-750 - Test Methods for Semiconductor Devices. * (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.3 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 General. The individual item requirements shall be as specified in MIL-PRF-19500 and as modified herein. 3.2 Qualification. Devices furnished under this specification shall be products that are manufactured by a manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list (QML) before contract award (see 4.2 and 6.4). 3.3 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as specified in MIL-PRF-19500. 3.4 Interface and physical dimensions. Interface and physical dimensions shall be as specified in MIL-PRF-19500, and on figure 1 (T0-66 ) and 2 (die) herein. 3.4.1 Lead finish. Lead finish shall be solderable in accordance with MIL-PRF-19500, MIL-STD-750, and herein. Where a choice of lead finish is desired, it shall be specified in the acquisition document (see 6.2). 3.5 Marking. Marking shall be in accordance with MIL-PRF-19500. 3.6 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance ch